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Endevco Signs Cooperative Research and Development Agreement with Sandia National Laboratories
September 24, 2002 |Estimated reading time: Less than a minute
Under the terms of the agreement, the companies will jointly develop a robust (60,000 g's), low volume, low power acceleration sensor (accelerometer) and a small acceleration recording device that will use the newly developed accelerometer. The CRADA will help Sandia facilitate the design and development of smaller, lower-power, acceleration-recording devices in support of its Defense Programs and Emerging Threats missions.
Washington, D.C. -- The International Microelectronics and Packaging Society (IMAPS) and the Ceramic Interconnect Initiative (CII) will bring enabling ceramic interconnect technology to the forefront with the "Ceramic Interconnect Technology: The Next Generation" conference, scheduled for April 8 through 9, 2003, at the Westin Hotel in Denver, Colo.