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Electronics Organizations Join Forces to Coordinate Worldwide Implementation of Lead-Free Solder
August 2, 2001 |Estimated reading time: Less than a minute
"The goal of this initiative is to channel the worldwide resources of electronics organizations and the companies they represent with the common goal of easing industry's transition to lead-free manufacturing," said Ruben Bergman, executive director for HDPUG and chair of the GECI Network. "By working toward standardized solutions, we can make it easier for companies to implement lead-free manufacturing processes, reducing both time and risk involved in this kind of industry-wide conversion. GECI will develop a global transition plan (roadmap) and share the upfront work needed to facilitate a transition. We will also work to help companies comply with environmental, market and legislative requirements."
PALO ALTO, Calif. - Agilent Technologies is offering free hour-long web seminars focusing on the strategies, issues and logistics facing OEMs, Electronic Manufacturing Service (EMS) providers and Contract Manufacturers who must work together to succeed in a hyper-competitive world.