-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
ADHESIVES/ COATINGS/ ENCAPSULANTS
December 31, 1969 |Estimated reading time: Less than a minute
Loctite - 3567
The first commercially available reworkable underfill, Loctite 3567 provides the reliability and processing ease of conventional thermoset underfills. It allows flip chips to be replaced on any device after testing determines that a chip is defective, minimizing board disposal and improving the cost-effectiveness of the manufacturing process. The underfill improves the reliability of BGA and CSP assemblies, particularly important for roughly handled consumer electronic applications. Simply heating the defective device to standard rework temperatures allows it to be removed from the PCB. Gentle high-speed brushing eliminates any remaining residue and prepares the site for a replacement device.