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inspection
December 31, 1969 |Estimated reading time: Less than a minute
ERSA Inc. - ERSASCOPE
X-ray inspection has established itself as the state-of-the-art for nondestructive in-line and off-line inspection of hidden solder joints, particularly for BGAs, CSPs and flip chips. While revealing many defects (e.g., bridges, misalignment and voids), other critical defects are more difficult or impossible to detect, such as excess flux residue, surface structure and micro-cracking. The ERSASCOPE offers a cross-sectional, nondestructive visual image of hidden solder joints by looking under the BGA. It is a benchtop, user-friendly, safe and cost-effective method for quickly inspecting all types of BGAs, µBGAs and flip chips.