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Sn/Ag/Cu Solders
December 31, 1969 |Estimated reading time: Less than a minute
This range of lead-free solders provides environmental benefits in meeting the WEEE Directive for 2004. Although the alloy (Sn/Ag/Cu) has a higher melting point than conventional tin/lead eutectics, it reportedly has a high resistance to thermal fatigue together with improved joint strength. Available as RMA and RA solder pastes and as RMA cored solder wire, the paste features the company`s Type 3 powder, which has an 11 percent flux content, 0.06 percent halogen and a typical viscosity of 180 Pas (the RA paste contains 0.2 percent halogen and viscosity of 220 Pas). Two types of flux-cored solder wire come in 0.3 to 2.3 mm diameters; SIR rating is 1 x 1013 W. Melting point of the series is 216∞ to 220∞C, and the lead-free range has a specific gravity of 7.4 with a shear strength of 52 Mpa. The CTE is rated at 21.3 x 10-6 per ∞C and creep fracture rating at 125∞C is more than 3,000 hours.
Senju Europe Ltd.
High Wycombe
Bucks, England.