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Workshops
December 31, 1969 |Estimated reading time: 1 minute
Of the more than 50 workshops and tutorials taking place at APEX, nearly 25 are being offered by the IPC for the first time. Every aspect of electronics assembly processes is to be covered by these workshops. "Given its importance in the industry, process control measures and quality assurance are two topics highly represented in this program," said IPC vice president of professional development John Riley.
Highlighting the list of APEX workshops are:
- Implementing Flip Chip Today - R. Wayne Johnson, Ph.D., Auburn University, gives insight into the design and assembly of electronics using flip chip devices and explores the practical issues of implementing flip chip technology.
- Lead-free Materials: Year 2000 and Beyond - Dr. Jennie S. Hwang, president of H-Technologies Group Inc. and SMT Magazine columnist and Editorial Advisory Board member, discusses lead-free solders from application perspectives and presents selection criteria for lead-free compositions, including material characteristics and product assessment.
- Process Control for BGA/CSP Assembly - Mark Owen, MV Technology Ltd., reviews manufacture and assembly processes for area-array devices; evaluates the technologies and tools available for process control; and details the selection, placement and use of these tools.
- Keys to Success for Contract Manufacturers - Ralph Kenton, Ralph Kenton & Associates and SMT Magazine Editorial Advisory Board member, provides insights for large and small CMs, detailing OEM expectations for suppliers in the areas of quality, cost reduction, technology and globalization.
- Supply Chain Partnering with Distribution - Guy Haden, NEDA, describes the distributor`s perspective of the supply chain, which could lead to an effective relationship between the distributor and a CM.