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Gap-filler Pads
December 31, 1969 |Estimated reading time: Less than a minute
These conformable, high-heat-conducting gel pads are said to fit and adhere to most shapes and sizes of components, including protrusions and recessed areas. Thermal impedance of devices mounted on substrates or at heat-sink junctions is said to be eliminated, yielding higher temperature transfer gradients. Four series, each with a different construction, include a hardened-top surface or mesh reinforcement for demanding applications.
Fujipoly
Kenilworth, N.J.