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Optimized BGA Inspection
December 31, 1969 |Estimated reading time: Less than a minute
The BGA II inspection package is an optimized version of the company`s machine vision hardware and software package for inspecting BGAs for missing, misplaced or improperly formed solder bumps. It reportedly combines the accuracy and reliability of the company`s original inspection package with MMX-accelerated inspection capability. The system is said to be able to inspect up to 10,000 solder bumps per second and offer support for large-format, high-resolution cameras. It also offers new software features, including masking.
Cognex Corp.
Natick, Mass.