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TAC
December 31, 1969 |Estimated reading time: 1 minute
This year`s TAC, organized by RRA Technical Services Inc., will include five newly designed and developed assembly lines showing state-of-the-art assembly technology. New processes that will be demonstrated in TAC 2000 include a lead-free operation and another line that uses a solder paste alternative process.
"We expect our lead-free high-density interconnect (HDI) line and our Y2K line to generate a lot of interest," said Steve Sytsma, director - TAC, RRA. "The lead-free line will show the attachment of surface mount devices (SMD), ball grid arrays (BGA), quad flat packs (QFP) and chip scale packaging (CSP) using lead-free solder and a lead-free PCB pad finish for both top- and bottomside attachment. The Y2K line will feature component attachment at very low temperatures using a solder alternative where the solder alternative material is actually electrically conductive. Conductivity will be demonstrated through the assembly of an electrically `live` PCB using live components such as LEDs and other SMDs."
Area-array assembly to form CSPs, flip chip fabrication and high-volume/high-pin-count demonstrations will also be featured, as well as a low-volume batch line producing PCBs populated with flip chips, CSPs and plastic BGAs.
TAC area process elements to be demonstrated and explained include stencil printing, fine-pitch placement, die placement, underfill dispensing, flux jetting, combined reflow and curing, and the latest in rework equipment and methodologies. Many of the process materials that cannot be easily evaluated under normal production conditions will be used in conjunction with these live assembly lines, including no-flow fluxing underfill, lead-free no-clean fluxing systems, and hybrid electroformed and laser-cut stencils with very low aspect-ratio stencil apertures. All these products can be viewed under production conditions in an environment that allows show attendees to ask questions and evaluate current and state-of-the-art assembly technologies.
New this year, the Contract Manufacturing Demonstration Line will build live PCB assemblies with SMT equipment provided by a contract manufacturer (CM).