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Kyzen Earns Best Paper Award at NEPCON South China
August 30, 2013 |Estimated reading time: 1 minute
Kyzen received a Best Paper award for its recent presentation during NEPCON South China, August 27-29, 2013. Part of the SMTA China 2013 Technology Conference sponsored by SMTA China South, Kyzen’s presentation was given by Jason Chan, Kyzen’s Asia technology manager, and took place at the Shenzhen Convention & Exhibition Center in Shenzhen, China.
The presentation, Stencil Printing Yield Improvement Capabilities, discussed the fact that stencil printing capabilities are becoming more important as the range of component sizes assembled on a single board increases. Coupled with increased component density, solder paste sticking to the aperture sidewalls and bottom of the stencil can cause insufficient solder paste deposits and solder bridging. Yield improvement requires increased focus on stencil technology, printer capability, solder paste functionality, and understencil cleaning.
Chan also explained how the wide range of required solder paste volume deposited on mixed technology assemblies is pushing traditional stencil design rules to their limit. There is a need for improved stencil, printing, and materials technologies to increase the consistency of the deposit. Cleaning the underside of the stencil is a critical enabler to yield improvement. The purpose of this research is to study the wipe sequence, wipe frequency and wipe solvent(s) and how these factors interact to provide solder paste printing yield improvement.
About Kyzen
Kyzen specializes in precision cleaning chemistries for electronics, advanced packaging, metal finishing and aerospace applications. Kyzen’s industry expertise and dedicated customer support provide integrated cleaning process solutions that meet any cleaning challenge. Founded in 1990, Kyzen is the leading provider of environmentally responsible, RoHS-compliant cleaning chemistries to industries worldwide. For more information, visit www.kyzen.com.