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Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
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Solving Inspection Problems with True 3D in AOI, AXI and SPI Systems
May 6, 2015 | Real Time with...IPCEstimated reading time: Less than a minute
SAKI America's family of true-3D inspection systems cover the whole spectrum of SPI, AOI and AXI tasks. Quintin Armstrong explains how the unique resolution capability of their AXI achieves 100% detection of head-in-pillow defects.
Watch the interview here.
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Real Time with... electronica 2024: SPEA's AI Integration—Innovations in Test Equipment
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iNEMI End-of-Project Webinar: Investigation of AI Enhancement to AOI for PCBA
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