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John Perry Explains IPC T-50 Revision M
June 24, 2015 | IPCEstimated reading time: 1 minute
IPC has released IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. This ever-evolving standard provides common language of terms and definitions for the electronics industry.
Each year, terms and definitions become relevant in the electronics industry and in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits,delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology.
IPC-T-50M brings more than 150 new and revised terms, while also eliminating out-of-date terminology in order to provide a streamlined standard that focuses on the trending language of the electronics industry. Specifically, this revision includes terms often cited in other standards, such as; conformal coating, statistical process control, and stencil design.
“Our goal is to update the IPC-T-50 standard as often as possible with significant terms and technology. We want to keep the document relevant in today’s rapidly changing industry,” said John Perry, IPC director of printed board standards and technology. “To accomplish this, we solicited input from subject matter experts within the electronic industry who worked on standards, such as the IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards, the IPC-6013C, Qualification and Performance Specification for Flexible Printed Boards, the IPC-HDBK-830, Guidelines for Design, Selection and Application of Conformal Coatings handbook, and the recent IPC-HDBK-850, Guidelines for design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly handbook.”
Stay up to date with the trending terms covering the newest emerging technologies. Learn more about T-50M by clicking here.
Suggested Items
STI Electronics Celebrates Frank Honyotski’s 25 Years of Service
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Axxon-Mycronic Showcases Precision Protection Technologies for Extreme Environments at Space Tech Expo
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Living His Dream: IPC EAO Course Leads Thejas K to Role as Quality Engineer
05/30/2025 | Michelle Te, IPC CommunityIt’s not often that a child wants to follow in the footsteps of their parents’ career. But Thejas K, a 22-year-old from Mysuru, India, whose mother Padmavathi was an EMS operator for nearly 20 years, is now an associate engineer in the quality department at Cyient DLM where PCB assemblies are manufactured for aerospace and defense.
GTSMT SMT Production Lines are Transforming Modern Electronics Manufacturing
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IPC Applauds Leadership of Reps. Moore and Krishnamoorthi on PCB Manufacturing Bill
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