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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Leading PCB Test Service Installed Second atg Flying Probe System
June 25, 2015 | atg Luther & Maelzer GmbHEstimated reading time: 1 minute
atg Luther & Maelzer GmbH has confirmed the installation of a second atg A7 flying probe test system for high-speed bare board testing at Circuit Technology Services.
The test system was chosen for its high performance and additional test capabilities such as Kelvin 4 wire, Embedded Component and HIPOT applications.
Circuit Technology Services of Santa Clara, CA is a leading test outsourcing provider located in the San Francisco Bay area. Their facility provides advanced test capabilities serving all leading PCB manufacturers throughout the US.
With 5 flying probe test systems, one capacitance based scanning unit and two Universal grid systems Circuit Technology Services will meet any customer demands.
atg Luther & Maelzer GmbH is based in Wertheim Germany. With more than 150 employees worldwide, atg Luther & Maelzer is the leading supplier of electrical testing solutions for the Printed Circuit Board industry. We have solutions for every application regardless of product type, batch size or technology deployed. Our atg flying probe tester products are renowned for Automation, speed, accuracy, versatility and ease of use, while the Luther & Maelzer universal grid tester product range is known worldwide for high throughput, repeatability, gentle handling and precision accuracy.
Atg’s A7 testers utilize 8 flying probe test heads, multiple optical recognition systems, and a wide variety of advanced, high-speed electrical test measurement techniques to electrically test all types of PCB’s for continuity and isolation. Board sizes of 24” x 21’ (or larger), with small pad/fine pitch technology can be tested quickly and easily. Special options, such as, 4-wire Kelvin tests, Hi-pot test, Latent defect test, and others can be provided.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Roundtable: Advanced Materials
04/27/2026 | I-Connect007 Editorial TeamDriven largely by the need for advanced chip technology for super compute ability and AI applications, low Dk, low-loss resin systems, and heavy copper laminate are attracting significant attention and global resources. There are numerous unavoidable challenges in this market that will impact manufacturers and the supply chain, and they may be hitting critical mass sooner than OEMs and fabricators think. In this roundtable discussion, moderator Marcy LaRont speaks with topic experts: Mark Goodwin, John Fix, and Ed Kelly.
Silicon Box Joins imec Automotive Chiplet Program to Strengthen Next-Gen Vehicle Supply Chains
04/22/2026 | PRNewswireSilicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles.
Mitate Zepto Technica Joins JST Edge AI Semiconductor R&D Program as Implementation Partner
04/22/2026 | PRNewswireMitate Zepto Technica, Inc., based in Tokyo's Shibuya district, announced on April 20 that it has joined the national research initiative "Next-Generation Edge AI Semiconductor Research and Development Program" promoted by the Japan Science and Technology Agency (JST).
Wearable Technology Market Expected to Reach $183.2 Billion by 2031, Growing at a CAGR of 12.75%
04/22/2026 | PRNewswireAccording to the report, the global wearable technology market size was valued at USD 54.8 billion in 2020 and is projected to reach USD 183.2 billion by 2031, registering a CAGR of 12.75% from 2022 to 2031.
Camtek Acquires Visual Layer to Strengthen Visual AI Capabilities in Inspection and Metrology
04/21/2026 | CamtekCamtek Ltd., a leading developer and manufacturer of inspection and metrology equipment for the semiconductor industry, announced that it has signed a definitive agreement to acquire Visual Layer, a Tel Aviv-based AI company specializing in visual analytics.