Marcy’s Musings: The Relentless Pursuit of Perfection
Dan’s Biz Bookshelf: ‘Do/Start'
Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
EIPC Now Accepting Orders for T-50 Revision M Report
July 6, 2015 | EIPCEstimated reading time: Less than a minute
Each year, a new slew of terms and definitions become commonplace in the manufacturing process. IPC's report T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board technology.
EIPC is now accepting orders for the hard copy of the report. For more information, email eipc@eipc.org.
Share on:
Suggested Items
AI Helps Build Smarter, More Resilient Power Grids
05/16/2025 | BUSINESS WIREAs society’s reliance on electricity deepens, artificial intelligence (AI) is reshaping how we manage power grids and optimize energy sources.
Join the Conversation: MESI 4.0 Summit 2025
05/15/2025 | Critical ManufacturingThe MES and Industry 4.0 International Summit 2025 (MESI 4.0 Summit), hosted by Critical Manufacturing, will bring together manufacturing leaders, technology experts, and industry pioneers in Porto on June 12-13, offering a unique platform to explore practical strategies for digital transformation and smart manufacturing.
Roca Printed Circuits Joins Forces with Epec Engineered Technologies, NetVia
05/14/2025 | Epec Engineering TechnologiesRoca Printed Circuits and Epec Engineered Technologies announced today that Roca has joined forces with Epec’s NetVia Group PCB division in Dallas, expanding the combined organization's ability to deliver a broader range of high-quality printed circuit boards and electronic solutions.
Innovative Technology Advancements in Test: HATS² Technology and Its Impact on Reliability Testing
05/14/2025 | Barry Matties, I-Connect007Ensuring the reliability of printed circuit boards (PCBs) has become increasingly difficult and critical, yet the development of advanced testing methodologies is essential to meeting industry demands and addressing persistent challenges. One significant innovation is the High Acceleration Thermal Shock (HATS²) test system, which transforms how reliability testing is conducted. After 40 years in the testing business at Microtek, Bob Neves is beginning a new journey with his company, Reliability Assessment Solutions Inc. (RAS).
EWPTE 2025: Wire Processing Innovation Driving Technical Dialogue
05/13/2025 | Brittany Martin, I-Connect007From cutting-edge automation to advanced testing and harness assembly solutions, the 2025 Electrical Wire Processing Technology Expo (EWPTE) delivered a packed exhibit floor, robust technical programming, and valuable peer-to-peer connections.