-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
EIPC Now Accepting Orders for T-50 Revision M Report
July 6, 2015 | EIPCEstimated reading time: Less than a minute
Each year, a new slew of terms and definitions become commonplace in the manufacturing process. IPC's report T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board technology.
EIPC is now accepting orders for the hard copy of the report. For more information, email eipc@eipc.org.
Suggested Items
Neways Firmly Expands Defense Business
04/21/2025 | NewaysNeways Electronics, the global innovator in mission-critical electronics, foresees very strong growth in its defense-related activities in the near term.
Wiring the World Together: IPC and WHMA Unveil Global Wire Harness Competitions and Championship
04/21/2025 | IPCIPC, in collaboration with the Wiring Harness Manufacturer's Association (WHMA), has organized the first-ever World Wire Harness Competitions and Championship.
Real Time with... IPC APEX EXPO 2025: Show Wrap Up–A Review with John Mitchell
04/21/2025 | Real Time with...IPC APEX EXPOMarcy LaRont sits down with Dr. John W. Mitchell on the last day of IPC APEX EXPO 2025, marking its 25th anniversary. They highlight the event's success and specifically recognize this year's technical conference and professional development tracks. They also discuss AI's role in electronics, as Mitchell urges professionals to improve their skills around AI to keep themselves valuable and relevant. AI is here to stay! He touches upon tariffs and promotes a diverse supply chain, emphasizing the essential ingredient of collaboration for mutual success. Ending on sustainability, he discusses IPC's launch of the Evolve program showcasing the industry's commitment to sustainability.
Hanon Systems Wins Third PACE Award for Visible-Light LED Photocatalyst Technology
04/18/2025 | PRNewswireHanon Systems, a leading global automotive thermal management supplier and subsidiary of Hankook & Company Group, has been named a winner of the 2025 PACE Awards. This marks the company's third win, making it the first Korean supplier to achieve this recognition.
Real Time with... IPC APEX EXPO 2025: Aster–Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.