Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
BAE Systems Installs ACE's KISS-103IL Selective Soldering System
July 30, 2015 | ACE Production Technologies, Inc.Estimated reading time: 1 minute
ACE Production Technologies, Inc., a leading supplier of selective soldering systems, is pleased to announce that the BAE Systems’ Fort Wayne operations has invested in a KISS-103IL in-line selective soldering system.
The KISS-103IL selective soldering system has been installed at the BAE Systems facility located in Fort Wayne, Indiana and is the third selective soldering machine BAE Systems has ordered from ACE Production Technologies.
“The KISS-103IL is a fully-configured SMEMA compatible selective soldering platform equipped with “Super Quick” processing speeds and the unique dual solder nozzle systems enabling the use of multiple nozzle shapes within the same program,” said Alan Cable President of ACE Production Technologies. “The KISS-103IL comes standard with the ACE automated fiducial location and correction system that offers seamless fiducial recognition and true automated X-Y alignment and corrects any skew of the printed circuit board.”
Cable added, “Other innovative features include the new SWAK-OS machine operating software which is a revolutionary graphics-based programming and editing machine control system that features fast program loading and program recall with minimal operator intervention. A major benefit of the SWAK-OS is the integrated board scanning function that automatically captures and saves an image of a printed circuit board to the selective soldering program.”
BAE Systems is a multinational defense, security and aerospace company with operations worldwide and is one of the world’s largest defense contractors. They are a global leader in the design and manufacture of defense electronic systems. Their product range includes electronic combat systems, sensors, defensive systems, communication systems, surveillance and targeting systems, military and civilian flight and engine controls, and hybrid drive systems.
About ACE
ACE Production Technologies, Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly. ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production. ACE also provides solderability testing, lead tinning services and process development services. For more information, visit www.ace-protech.com, call 509-924-4898 or email sales@ace-protech.com.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.