-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Metcal's Paul Wood to Present at the BEST Tech Symposium
September 2, 2015 | MetcalEstimated reading time: 1 minute
Paul Wood of Metcal is speaking at the BEST Tech Symposium on Small Package Challenges, scheduled to take place Thursday, Oct. 1, 2015 at Pinstripes - South Barrington in South Barrington, Illinois. Wood will present “Hand Soldering Techniques for Small Packages.”
“I am delighted to speak about hand soldering techniques for small packages at the Best Tech Symposium,” said Wood, Metcal’s advanced product applications manager. “The list of topics and speakers at the symposium will address a number of assembly challenges and should be a great benefit to anyone facing these issues.”
There are numerous challenges for the rework technician in trying to rework very small outline packages such as 0201 and 01005s, and ultra-fine pitch small outline parts such as SOICs with a 0.3 mm pitch. Modern hand tools and techniques are required to rework these devices. The hand tools need to be very small, light, ESD-safe tools with low air flow and closed-loop controls for airflow and heat. This talk will focus on how such a tool can be used to make the rework of these small packages simpler and faster. In addition, various “how to” techniques through photos and application videos will be highlighted.
Wood is an industry expert in the BGA/CSP/array package rework arena. With 33 years of service at OK International, Inc., and 42 years of experience in the electronics industry, Mr. Wood has used his global experience in rework to keep electronics assembly manufacturers on the leading edge of technology.
In addition to Wood, the BEST Tech Symposium will feature a number of other speakers, all discussing different aspects of assembly challenges of small packages. The symposium promises to increase attendees’ understanding of the challenges involved in small footprint device assembly.
About Metcal
Since 1982, Metcal has been a recognized worldwide leader in the electronics assembly marketplace. As part of OK International, Metcal’s industry-leading position addressing advanced technology in conduction soldering and rework/repair, has and will continue to broaden to a full electronics bench tool single-source solution. Metcal product lines currently include: hand soldering and desoldering, convection rework products, fume extraction and fluid dispensing tools.
Suggested Items
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.
GPV’s Q1 2024 Interim Financial Report Shows Strong Navigation in Uncertain Times
05/01/2024 | GPVDanish-based GPV recorded an expected drop in sales to DKK 2.3 billion for the first quarter of 2024. The decline also affected the operating profit, which was DKK 155 million compared to DKK 179 million in the same quarter last year, although the EBITDA margin was maintained. In general, demand has been softer in 2024, but GPV continues to invest for the long-term and expects the trend to turn in the second half of 2024.
All-Inclusive: PRIDE Industries Helps Employees With Disabilities to Succeed
05/01/2024 | Sandy Gentry, IPCPRIDE Industries is the leading employer of people with disabilities and those with other barriers to employment in the United States, including veterans and former foster youth. The company offers job training, placement, on-the-job coaching, and skills development for independent living. It has held IPC membership since 2000. Read more about this unique business and its connection to the electronics manufacturing industry.