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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
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Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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New Date and Location for EIPC-EFRA-CEFIC Workshop
September 17, 2015 | EIPCEstimated reading time: 1 minute
In conjunction with CEFIC and EFRA (the European Flame Retardants Association), EIPC are pleased to announce that they will be holding a workshop on Wednesday November 11, 2015 at Productronica, in Munich, Germany from 10:00 am -12:30 pm.
Flame retardants find use in many segments of the electronics industry; all of which provide protection from fire hazards to improve user safety.
During this workshop you will learn about the following topics;
- EU Legislative framework, RoHS REACH and WEEE and End of Life
- Possible impact of EU legislation on future PCB manufacture in Europe
- Legislative status of TBBPA, the most widely used flame retardant in PCBs
The speakers will include Mr. A. Morgan, Chairman EIPC, Prof. M. Goosey, VP Technology EIPC who will be accompanied by Mr. P. Salemis of EFRA and Mr. F. Kohl of ICL.
Workshop agenda:
- Introduction EFRA - P. Salemis
- Overview on Legislation - Prof. M. Goosey
- Flame retardant use in PCB Base Materials - A. Morgan
- Lunch
- RoHS 2, current status and future impact - F. Kohl
- Recycling, end of life - P. Salemis
- REACH process for end users - EFRA
- Panel Q&A
Workshop fee:
EIPC Members / EFRA members: € 200.-
Non-members: € 300.-
Additional employee from the same company 20% discount: € 160.- / € 240
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