-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Physics of Failure Durability Simulations for Automotive Electronics
September 30, 2015 | James G. McLeish and Tom O'Connor, DfR SolutionsEstimated reading time: 1 minute

Automotive electronics systems are becoming increasing complex and essential for the proper, safe operation of cars and trucks. Vehicle controls for basic operation and safety functions are increasingly being implemented by electronic modules. The ability of these electronic systems to function reliably is becoming a greater aspect of vehicle safety as was dramatically demonstrated by the 2009–2011 recall of over 9 million Toyota vehicles for unintended acceleration issues.
After the Toyota incident, the U.S. National Academy of Science issued “Special Report #038: The Safety Challenge and Promise of Automotive Electronics—Insights from Unintended Acceleration” in January 2012. The report cited that federal safety regulators in the National Highway Traffic Safety Administration (NHTSA) lack the expertise to monitor vehicles with increasingly sophisticated electronics, as was demonstrated by the need for NHSTA to call in NASA electronic personnel to assist in the investigation.
But 2014 was an even worse year for the auto industry, plagued with a record 700 recalls of over 60 million vehicles that has cost billions of dollars, involved numerous NHTSA safety investigations, record federal fines, damning publicity, unsettled legal liabilities, and congressional investigations. Severe new vehicle safety legislation is now under consideration. With many of these reliability issues, the vehicles’ systems functioned for years before failures with safety consequences occurred. Others involved situations where product teams, executives and regulators did not recognize the safety consequences of product and system quality, reliability and durability (QRD) capabilities, especially when new technology is involved. The industry now searches for ways to ensure that this never occurs again.
While electronic reliability issues were widely suspected, but eventually ruled out as a root cause, the crisis revealed the challenges of evaluating, validating and investigating the reliability and safety assurance aspect of modern, distributed and interactive vehicle controls systems that are equally taxing on OEMs, electronic system suppliers and regulators.
Meanwhile, in Europe, the new standard ISO 26262, "Road Vehicles—Functional Safety," defines an automotive-specific approach for determining risk classes and requirements for validation and confirmation measures to ensure a sufficient and acceptable level of safety and reliability is being achieved.
To read this entire article, which appeared in the September issue of The PCB Design Magazine, click here.
Suggested Items
L3Harris Receives $214 Million in Orders to Support German Armed Forces
05/12/2025 | L3Harris TechnologiesL3Harris Technologies has received multiple orders expected to total $214 million under Germany’s Digitalization – Land Based Operations (D-LBO) program.
AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030
05/09/2025 | IDTechExBy 2030, the new report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts" from market intelligence firm IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.
OSI Systems Receives $36 Million Contract for Aviation Security Systems
05/08/2025 | BUSINESS WIREOSI Systems, Inc. announced that its Security division received a contract award for approximately $36 million to deploy and service airport screening solutions for a prominent international airport in the Middle East.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.