Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
L3Harris Receives $214 Million in Orders to Support German Armed Forces
May 12, 2025 | L3Harris TechnologiesEstimated reading time: Less than a minute
L3Harris Technologies has received multiple orders expected to total $214 million under Germany’s Digitalization – Land Based Operations (D-LBO) program. These orders include delivery of interoperable communication systems to enhance the operational capabilities of the German armed forces.
“Resilient and immediate communication among allies is crucial for countering threats posed by aggressive adversaries,” said Sam Mehta, President, Communication Systems, L3Harris. “We are proud to support our NATO ally with our trusted communications technology, which has demonstrated its value in the field by protecting soldiers and networks at the tactical edge.”
L3Harris’ resilient communications solutions leverage battle-tested hardware and robust waveform technology, which support the D-LBO program’s objective for German armed forces to be more operationally efficient and coalition interoperable.
These orders follow other recent awards the company has received for Falcon® radios, including for the Netherlands’ FOXTROT and the U.S. Army’s HMS programs.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Armstrong Asia Signs MOU with Checkmate Capital Group to Explore Strategic Collaboration
09/15/2025 | GlobeNewswireArmstrong Asia, a leading Singapore-based manufacturer of flexible material solutions with 16 factories across 7 countries in Asia, has signed a Memorandum of Understanding (MOU) with Checkmate Capital Group, LLC (“Checkmate Capital”), a U.S.-based investment and advisory firm active in the Asia-Pacific and North American regions, focused on cross-border transactions in the life sciences, medical technology, and other industries.
AI-Powered Wearables Transform How Consumers Interact with Everyday Technology
09/15/2025 | PR NewswireThe global demand for AI-driven, touchless wearable technologies is accelerating as consumers seek more natural, seamless and intuitive ways to interact with their devices. Traditional touch screens and voice assistants, while effective, are increasingly viewed as limiting in a world where multitasking, mobility and efficiency are key. As industries from consumer electronics to augmented reality and enterprise computing embrace the possibilities of gesture-based control, the market for neural interfaces is rapidly expanding
Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
09/09/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO).
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.