Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Insulectro Hosts Silicon Valley Designers Council Meeting
October 21, 2015 | Barry Matties, I-Connect007Estimated reading time: 1 minute
On October 15, about 25 people gathered for the IPC Designers Council Silicon Valley Chapter meeting at Insulectro's facility in Mountain View, California. The 1.5-hour meeting opened with a warm welcome from Chapter President Bob McCreight, CID, a PCBA designer at Tesla Motors, and Jason Marsh, VP of product management at Insulectro.
The meeting focused on solder joints, and how circuit design can contribute to the success or failure of a solder joint.
Carl Schattke, senior PCB design engineer at Tesla, was the main speaker. Carl's presentation covered a variety of facets of PCB design, from shadowing to the location of component based on weight and surface finishes. The presentation was filled with great images that supported Schattke’s thoughtful coverage of these topics.
The room was filled primarily with well-seasoned circuit designers, a couple of suppliers, and a few people from Shenmao Technology Group, who provided some of the PowerPoint images for Schatte’s presentation.
About the IPC Designers Council
The IPC Designer's council was formed in 1991 to provide continuing education of the PCB designer. There is no cost to join the Designers Council. While regular IPC membership is reserved for companies, the Designers Council is a separate professional society for individuals, with its own separate benefits. These include discounts on design-related events and IPC standards, as well as the chance for designers to advance their technical education and network with other PCB designers and technologists at local chapter meetings.
Local chapters host roundtable discussions, facility tours, and “lunch & learn” presentations on critical design and manufacturing issues. Chapters also form study groups to help members study for the CID (Certified Interconnect Designer-Basic) and CID+ advanced exams.
There are Designers Council chapters around the world, but there might not be a local DC chapter near you. Don’t despair. If you have at least 12 designers who can meet at least four times a year, why not start your own chapter?
If you would like to learn more about the IPC Designers Council, or even start your own local chapter, send an e-mail to design@ipc.org, or visit http://dc.ipc.org.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.