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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Have You Seen I-Connect007's Coverage of productronica 2015?
November 17, 2015 | I-Connect007Estimated reading time: 1 minute
If you didn’t make it to Munich for productronica 2015, don’t worry. I-Connect007 has complete coverage of this long-running industry event at our RealTime with... show site.
About 38,000 visitors from around the world helped celebrate the 40th anniversary of productronica, and show managers say the share of Asian attendees rose “considerably” this year. And 97% of visitors rated productronica “good” to “excellent,” according to reports.
“During the past four days of the fair, we have experienced the industry's unbelievable innovative strength,” said Falk Senger, managing director of Messe München. "That underscores productronica's position as an international industry gathering for electronics development and production."
This year’s show also marked a first: The launch of the productronica Innovation Awards. A panel of judges chose the most innovative products from almost 70 entries. Winners included Fuji Machine (PCB & EMS), Rehm Thermal (SMT), F&K Delvotec (Semiconductors), Schleuniger (Cables, Coils & Hybrids), and Asys (Future Markets).
Thanks to our generous sponsors, the I-Connect007 team was available to cover the show from start to finish. The result? A total of 18 in-depth RealTime with…productronica video interviews with the industry’s top engineers, technologists, and managers, along with 126 photos of the event.
We’ll also be bringing you written interviews with these movers and shakers in the next few months, courtesy of The PCB Magazine, SMT Magazine, and The PCB Design Magazine.
So, if you didn’t make it across the pond last week, don’t despair. We have you covered. To view I-Connect007’s video coverage of productronica 2015, click here.
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Rachael Temple - AlltematedSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.