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The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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IPC Leads Joint Industry Comments on EPA TBBPA TSCA Plan
November 23, 2015 | IPCEstimated reading time: Less than a minute
On October 18, 2015, IPC – Association Connecting Electronics Industries, the Association of Home Appliance Manufacturers (AHAM), the Consumer Electronics Association (CEA), the Information Technology Industry Council (ITIC), and the National Electrical Manufacturers Association (NEMA) filed joint comments on the U.S. Environmental Protection Agency’s (EPA’s) TSCA Work Plan Chemical Problem Formulation of Tetrabromobisphenol A and Related Chemicals Cluster (Plan).
IPC and its fellow commenters voiced concern that the EPA’s Plan contains incomplete and inaccurate information regarding the uses of Tetrabromobisphenol A (TBBPA). The comments discussed in its main application (approximately 90 percent), TBBPA is chemically reacted to the epoxy resin upon which printed circuit boards (PCBs) are built. The comments note that EPA failed to distinguish between the additive and reactive uses of TBBPA and recommends that EPA separately delineate and assess, within any consumer exposure scenario, exposure as a result of additive and reactive uses of TBBPA. The comments also note that EPA has incorrectly interpreted studies regarding the presence of TBBPA in children’s products.
The comments encourage EPA to revise its planned assessment to more accurately assess use and exposure to TBBPA.
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The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.