-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC APEX EXPO 2016 Educational Programs Highlight Research, Innovation and Forward Thinking
December 14, 2015 | IPCEstimated reading time: 2 minutes

The latest technical research, industry best practices, ground-breaking technologies and forward thinking innovations will take center stage throughout the IPC APEX EXPO 2016 technical conference and professional development courses, which will take place March 13–17 at the Las Vegas Convention Center in Las Vegas, Nevada. Registration is now open at www.IPCAPEXEXPO.org.
In keeping with the event’s theme, “Forward Thinking for Tomorrow’s Technology,” the technical conference will feature approximately 80 technical papers detailing original research and innovations from industry experts around the world. Subject-matter experts will cover topics in the areas of board fabrication and design, electronics assembly and test.
Attendees wanting to learn more about best practices in design, lead-free technologies, materials, process improvement, solder joint reliability, PCB fabrication and materials, quality and reliability and more, can choose from 20 professional development courses that go beyond theory to provide practical solutions that could be implemented immediately.
“Our wide-ranging educational program features a variety of learning opportunities where attendees can access the latest research and development in the industry and learn more about trending materials, applications and processes such as graphene, printed electronics and 3D printing,” said IPC Technical Conference Director Jasbir Bath. “They can take everything they learn back to their company and put it all to work.”
In addition, IPC APEX EXPO features many free activities, including technical BUZZ sessions, poster presentations, keynotes on “Inventions and Innovations” by inventor and entrepreneur Dean Kamen and “Inside the Rise of the Warbots” by strategist and senior fellow at the New America Foundation, Peter Singer. The highly popular New Products Corridor and the IPC APEX EXPO Hand Soldering Competition will again be featured along with more than 440 of the industry’s top suppliers.
Access to the exhibit hall is free to those who register in advance, a savings of $35 on-site. Attendees who register by January 29, 2016, will save 20 percent off registration fees. In addition, attendees who register for the All-Access Package will save a significant percentage off a la carte options.
More information about IPC APEX EXPO 2016, including details on education and technology, network opportunities, show floor activities, schedule, travel and more is available at www.IPCAPEXEXPO.org.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
SASinno Americas Introduces the Ultra Series
10/07/2025 | SASinno AmericasSASinno Americas has introduced the new Ultra Series, the latest generation of offline selective soldering systems. Available in two models—the Ultra-i1 and Ultra-i2—the new series is designed to meet the needs of manufacturers running small to medium batch sizes, multiple product types, and frequent line changes, while maintaining exceptional precision and process control.