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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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2015's Most Read PCB Interviews
December 30, 2015 | I-Connect007Estimated reading time: 2 minutes
Over the course of the year, we have talked to a lot of industry experts and engineers about the latest technology developments and business opportunities and challenges in the PCB fabrication industry. For 2015, here are the top 10 most-read interviews.
Multek CTO Excited About the Challenges of the Fast-Moving Wearables Market
Multek CTO Dr. Joan Vrtis sat down at IPC APEX EXPO to discuss the rapidly evolving wearables market, especially for medical, and the myriad questions that must be addressed. Other topics include Multek’s contribution to the wearables industry and what it sees as the main challenges to putting their circuits into various applications.
Zentech’s John Vaughan on the Mil/Aero Sector: “It’s Headed Up”
I-Connect007 publisher Barry Matties and Zentech’s John Vaughan had a chance to discuss industry concerns within the mil/aero segment at IPC APEX EXPO 2015. The two also shared thoughts on the space industry.
Reliability and Harmonization of Global Standards at Forefront of EIPC Efforts
At IPC APEX EXPO 2015, Iconnect007 technical editor Pete Starkey caught up with eIpc’s Michael Weinhold and alun Morgan, who were happy to discuss both recent and ongoing focuses for eIpc, namely, reliability. Also touched on was the importance of the alignment of global standardization processes, especially for Asia.
A Conversation (and Day) with Joe Fjelstad
I-Connect007 publisher Barry Matties and industry veteran Joe Fjelstad, CEO and founder of Verdant Electronics, met recently to spend a day together enjoying their conversation that ebbed and flowed between a wide variety of topics including the “war against failure.”
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