It's Only Common Sense: Leveraging AI in Your Sales Strategy
Dan’s Biz Bookshelf: 'Hidden Potential: The Science of Achieving Greater Things'
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
i3 Electronics To Exhibit At DesignCon 2016
January 12, 2016 | i3 Electronics, Inc.Estimated reading time: 1 minute
i3 Electronics, Inc. (i3) will be exhibiting at DesignCon 2016, which will be held at the Santa Clara Convention Center in Santa Clara, California January 19-21.
i3 will showcase their advanced printed circuit board and semiconductor packaging technology for the industrial, commercial, medical and aerospace industries. In addition, i3 will have information available on their world-class advanced laboratory services and their Current Induced Thermal Cycling (CITC) test technology, which holds many distinct advantages over traditional printed circuit board reliability tests.
i3 will be in booth #1155.
About i3 Electronics
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of: design and fabrication of printed circuit boards & advanced semiconductor packaging; high speed laminate expertise; advanced assembly services; reliability & signal integrity reliability lab services; high speed back plane & press fit assembly; and flex, rigid-flex & 2.5 & 3D die assembly. i3 product lines meet the needs of markets including aerospace & defense, medical, high performance computing, industrial, telecom, semiconductor & test and alternative energy, where highly reliable products built in robust manufacturing operations are critical for success.
About DesignCon
DesignCon, produced by UBM Canon, is the world’s premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This four-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry’s leading experts and solutions providers. More information is available at: www.designcon.com/santaclara/. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Honeywell-Led Consortium Receives UK Government Funding to Revolutionize Aerospace Manufacturing
09/02/2025 | HoneywellA consortium led by Honeywell has received UK Government funding for a project that aims to revolutionize how critical aerospace technologies are manufactured in the UK through the use of AI and additive manufacturing.
Coherent Announces Agreement to Sell Aerospace and Defense Business to Advent for $400 Million
08/15/2025 | AdventCoherent Corp., a global leader in photonics, today announced that it has entered into a definitive agreement to sell its Aerospace and Defense business to Advent, a leading global private equity investor, for $400 million. Proceeds will be used to reduce debt, which will be immediately accretive to Coherent’s EPS.
KYZEN Partners with LPW to Elevate High Purity Cleaning with Cutting-Edge Cyclic Nucleation Technology in North America
08/13/2025 | KYZEN'KYZEN, a global leader in advanced cleaning solutions, has reached a major milestone in high-purity cleaning with the addition of a state-of-the-art Vacuum Cyclic Nucleation System at its North American Application Lab.
Jeh Aerospace Raises $11M to Boost Aircraft Supply Chain
08/12/2025 | I-Connect007 Editorial TeamJeh Aerospace, the high-precision aerospace and defense manufacturing startup founded by Vishal Sanghavi and Venkatesh Mudragalla, has raised $11 million in a Series A round led by Elevation Capital, with support from General Catalyst, to scale its commercial aircraft supply chain manufacturing in India, according to OEM.
New Frontier Aerospace and Air Force Institute of Technology Sign CRADA to Advance Hypersonic VTOL Aircraft
08/05/2025 | PR NewswireNew Frontier Aerospace (NFA) is excited to announce a Collaborative Research and Development Agreement (CRADA) with the Air Force Institute of Technology (AFIT) aimed at advancing an innovative rocket-powered hypersonic Vertical Takeoff and Landing (VTOL) aircraft.