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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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EIPC Speednews: News from the European PCB Industry
January 27, 2016 | EIPCEstimated reading time: 1 minute
- EIPC Workshop "Metallization and Surface Finishes", at Fraunhofer IZM, Berlin, February 17
- Save the date: EIPC Summer Conference Edinburgh, June 9 & 10
- Viking on the move
- Southern Manufacturing returns to FIVE
- Ventec International Group grow US Technical Team with the appointment of Mark Nemecek
- Apple's Iron Grip on Our Smartphone World
- Taiyo, Donnie Monn; Wouldn't you really rather have a "Volkswagen" or Not your father's "Volkswagen"
Semiconductor Industry News
- Amazon Enters Semiconductor Business With Its Own Branded Chips
- Altair Semiconductor Expands Global Operations, Opening New R&D Center in Taiwan
- Apple Scales Back Orders For Its iPhones
- Intel acquires Ascending Technologies, an Autopilot Drone Maker
- Multi-Touch Display Features 3D Gesture Control
- Samsung, LG Expand Battlefield to Auto Electronics
- Samsung Puts 3D NAND Production Line in Xi'an Into Full Operation
- ST's Digital Power Amps Promise Clear Audio For Cars
- First WiFi Kiosks set to land on New York's streets
- 2,500 More Wi-Fi Hotspots to rise across India
- In-Building Mobile Data Traffic To See 6-Fold Growth By 2020
- Sweet Tooth? Print Yourself Some Chocolate
- News from IPC
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
IPC CFX Demo Line Debuts in Korea at EMK 2026
04/10/2026 | Global Electronics AssociationAt Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.
IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities
04/10/2026 | Circuit Technology Center, Inc.Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.
IPC Masters Competition China 2026 Unveils Winners, Empowering Advanced Talent Development in Electronics Manufacturing
04/01/2026 | Global Electronics AssociationOn March 25–27, the IPC Masters Competition China was held in Pudong, Shanghai. This year’s competition brought together 623 leading professionals in the electronics industry from 21 provinces and municipalities.
Global Electronics Association, MIMOS Berhad Sign MoU to Advance Malaysia’s Electronics and Semiconductor Ecosystem
03/31/2026 | Global Electronics AssociationThe Global Electronics Association and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.