Trouble in Your Tank: Understanding Interconnect Defects, Part 1
It’s Only Common Sense: Marketing Isn’t Fluff, It’s Ammunition
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
EIPC Speednews: News from the European PCB Industry
January 27, 2016 | EIPCEstimated reading time: 1 minute
- EIPC Workshop "Metallization and Surface Finishes", at Fraunhofer IZM, Berlin, February 17
- Save the date: EIPC Summer Conference Edinburgh, June 9 & 10
- Viking on the move
- Southern Manufacturing returns to FIVE
- Ventec International Group grow US Technical Team with the appointment of Mark Nemecek
- Apple's Iron Grip on Our Smartphone World
- Taiyo, Donnie Monn; Wouldn't you really rather have a "Volkswagen" or Not your father's "Volkswagen"
Semiconductor Industry News
- Amazon Enters Semiconductor Business With Its Own Branded Chips
- Altair Semiconductor Expands Global Operations, Opening New R&D Center in Taiwan
- Apple Scales Back Orders For Its iPhones
- Intel acquires Ascending Technologies, an Autopilot Drone Maker
- Multi-Touch Display Features 3D Gesture Control
- Samsung, LG Expand Battlefield to Auto Electronics
- Samsung Puts 3D NAND Production Line in Xi'an Into Full Operation
- ST's Digital Power Amps Promise Clear Audio For Cars
- First WiFi Kiosks set to land on New York's streets
- 2,500 More Wi-Fi Hotspots to rise across India
- In-Building Mobile Data Traffic To See 6-Fold Growth By 2020
- Sweet Tooth? Print Yourself Some Chocolate
- News from IPC
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EIPC Technical Snapshot: Sustainability in Electronics Manufacturing
11/06/2025 | Pete Starkey, I-Connect007EIPC selected the highly topical issue of sustainability in electronics manufacturing for the 24th Technical Snapshot webinar on Oct. 29, with guest speakers Satoshi Konagai of Elephantech and Liisa Hakola of the VTT Technical Research Centre of Finland. The program was moderated by Kirsten Smit-Westenberg, executive director of EIPC, who also introduced each speaker.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
Life Is a Highway: A Family of 8 Turned the Entire U.S. Into a Learning and Working Environment
11/04/2025 | Steven Bowles, Lockheed MartinIt’s 6:45 a.m. in a modern A-frame cabin tucked into the misty edges of the Cascade Range in Arlington, Washington. I’ve just made a quick Nespresso, checked my calendar of virtual meetings, and verified the Airbnb’s Wi-Fi speed is holding steady. In the next room, my wife Lynsey corrals our six kids into breakfast while planning a day trip to Seattle’s Children’s Museum. By 7:30, I’m camera-ready in a makeshift office nook, leading a discussion on HDI PCB design for an IPC standards committee. After a busy day, our Bowles crew, ranging in age from 1 to 10 years old, is hands-on with activities and exhibits in the museum.
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.