-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Best Technical Paper at IPC APEX EXPO 2016 Selected
February 18, 2016 | IPCEstimated reading time: 1 minute

The best technical conference paper of IPC APEX EXPO 2016 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, March 15.
Taking top honors, the winning paper is “Round Robin of High Frequency Test Methods by IPC-D24C Task Group,” by Glenn Oliver, DuPont Electronics & Communications. His co-authors were John Andresakis, Park Electrochemical; Chudy Nwachukwu, Isola; John Coonrod, Rogers Corporation; David L. Wynants, Sr., Taconic Advanced Dielectric Division; and Don DeGroot, Connected Community Networks, Inc. The paper will be presented during Technical Conference Session 10 on Wednesday, March 16.
An honorable mention went to “Optimizing Thermo-Mechanical Reliability of Components with Flat Gull Wing Leads,” by Simon Wolfangel, Robert Bosch GmbH. His co-authors included: Udo Welzel, Stefan Scheller, Marc Nikolussi and Dietmar Schlenker, all of Robert Bosch GmbH. This paper will be presented during Technical Conference Session 1 on Tuesday, March 15.
The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.
To register for the IPC APEX EXPO technical conference or for more information on all the activities taking place including standards development committee meetings, professional development courses, the exhibition and more, click here.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Considering the Future of Impending Copper Tariffs
07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.
Foxconn, TECO Announce Strategic Alliance Targeting AI Data Center Capabilities
07/30/2025 | PRNewswireHon Hai Technology Group (Foxconn) and TECO Electric & Machinery Co Ltd Ltd (TECO) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race.
Sypris Wins Awards to Support Subsea Cable Systems
07/29/2025 | BUSINESS WIRESypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced it has secured follow-on contract awards from a leading global provider of subsea cable systems. Under the terms of the agreement,
Creating Connections in Mexico
07/30/2025 | Michelle Te, Community MagazineA concerted effort by the Global Electronics Association—Mexico team over the past year has created inroads for the Global Electronics Association (formerly IPC) with leading electronics companies, government offices, and academic institutions in Mexico. “Our goal is to bring more awareness to what the Global Electronics Association is and what it offers,” says Lorena Villanueva, senior director. “We also aim to increase our membership. Of 3,200 members of the Global Electronics Association, only 180 are in Mexico.”
North American EMS Industry Down 8.9% in June
07/29/2025 | Global Electronics AssociationThe Global Electronics Association announced today the June 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.28.