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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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IPC Joins NextFlex
February 26, 2016 | IPCEstimated reading time: 1 minute
IPC — Association Connecting Electronics Industries has become a partner of NextFlex, America’s flexible hybrid electronics manufacturing institute, which is based in Mountain View, Calif. As part of the National Network for Manufacturing Innovation (NNMI), this new public-private partnership aims to establish America as the global leader in the flexible hybrid electronics manufacturing space.
Among other things, as a NextFlex partner, IPC will apply its strength and expertise in standards development to assist the institute in creating roadmaps for industry standards for flexible hybrid electronics manufacturing. Since 2012, IPC has published five standards on printed electronics materials, processes, terms and definitions, and design. The IPC Printed Electronics Committee is also working on six additional standards. As a member of the institute, IPC and NextFlex will explore ways to collaborate on printed electronics standards and test methods. Collaborative efforts will provide the printed electronics community with the standards and education needed to advance this technology, shorten product lead times, and improve and enhance product performance.
“IPC looks forward to being a part of NextFlex to advance innovation in flexible hybrid electronics manufacturing,” said Ken Schramko, IPC director of government relations. “IPC has been a strong supporter of the NNMI, which was launched by the Administration to drive American competitiveness in advanced manufacturing. IPC played a lead role in promoting the Revitalize American Manufacturing Innovation (RAMI) Act of 2014. This legislation authorized the NNMI and was signed into law by President Obama in December 2014.”
For more information on NextFlex or the NNMI, contact Ken Schramko, at KenSchramko@ipc.org.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
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