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AS9100 Rev C 2016 Audit Success at Ventec's UK Facility
March 8, 2016 | Ventec International GroupEstimated reading time: 1 minute
Ventec International Group is proud to announce that its European Headquarters in the United Kingdom continues to be fully accredited to AS9100 Revision C, in accordance with the Aerospace Supplier Quality System Certification Scheme. Re-certification was granted after successfully passing the 3-year audit of the facility's quality management system with zero non-conformances.
PCB fabrication customers servicing the aviation, space and defense industries can continue to rely on Ventec's fully accredited supply chain for high reliability laminates and pre-pregs. From manufacture through fabrication and delivery, Ventec's high quality product portfolio of polyimides, high reliability FR4 and its latest 'tec-speed' range of high speed/low loss materials are all covered by the accreditation.
Mark Goodwin, COO Europe and USA commented: “Our accredited supply chain complements the AS9100C quality management systems of our PCB customers, enabling aerospace OEMs to engage Ventec as a strategic partner in their safety critical supply chains, based not just on the proven performance of our materials but on our commitment to managing delivered quality to the highest standards.”
For more information about Ventec’s solutions and the company’s wide variety of products, please click here.
About Ventec International Group
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry.
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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
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Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
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