Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

ASC Sunstone Circuits to Exhibit at PCB East 2026

04/26/2026 | ASC Sunstone Circuits
Anaya Vardya, President and CEO of ASC Sunstone Circuits, a leading provider of printed circuit board (PCB) fabrication and assembly solutions, announced that the company will be exhibiting at PCB East 2026, taking place April 29 at the DCU Convention Center.

ICAPE Expands in Southern Europe with TEKUBE PCB Acquisition in Italy

04/23/2026 | BUSINESS WIRE
The ICAPE Group, a global technology distributor of printed circuit boards (PCBs) and custom electronic parts, announces the signing and the closing of an agreement for the acquisition of the PCB trading activities of TEKUBE SRL.

NCAB Group Reports Strong Q1 2026 Results Driven by AI-Led Market Growth

04/23/2026 | NCAB Group
NCAB Group AB has released its Interim Report for the first quarter of 2026, reporting double-digit growth in net sales, a significant surge in order intake, and improved profitability amid a dynamic global PCB market environment.

ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips

04/21/2026 | Advanced Chip and Circuit Materials
Advanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.

Zhen Ding Board Approves Subsidiary Leading Technology’s Hong Kong Listing Plan

04/20/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced (17th) that its Board of Directors has approved a proposal for its subsidiary, Leading Interconnect Semiconductor Technology (Shenzhen) Co., Ltd., to apply for a listing on the Hong Kong Stock Exchange.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in