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EIPC Speednews: News from the European PCB Industry
April 8, 2016 | EIPCEstimated reading time: Less than a minute
- Schweizer announces preliminary, unaudited group figures for FY2015
- Preview for Seica at SMT Nuremberg April 26-28, 2016
- High Density Packaging (HDP) User Group Member Meeting, May 25-26, 2016
- REPRIME: The application of advanced ultrasonics to replace explosive precursors and poisons used in industrial metal plating processes
- MACFEST: Manufacturing Advanced Coatings for Future Electronic Systems
- ICT Annual Symposium on June 1, 2016
- News from IPC
- News from JPCA
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