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Benchmark Electronics to Report 1Q 2016 Results on April 21
April 11, 2016 | Benchmark Electronics Inc.Estimated reading time: Less than a minute
Benchmark Electronics Inc. will announce its first quarter results on April 21, 2016, before the market opens. The company will host a conference call to discuss the results later that day at 10:00 a.m. Central Time (11:00 a.m. Eastern Time).
The live webcast of the call and accompanying reference materials will be accessible by logging on to the company's website. A replay of the broadcast will also be available until April 28, on the company's website.
Suggested Items
Benchmark Appoints Ramesh Gopalakrishnan to the Board of Directors; Board Member Bruce Carlson Retires
10/14/2021 | Benchmark Electronics Inc.Benchmark Electronics, Inc. has announced the appointment of Ramesh Gopalakrishnan as an independent director to the Company's Board of Directors, effective October 11, 2021. Benchmark also announced the retirement of Bruce Carlson, who has served as a board member since 2017, also effective October 11, 2021.
Lincoln International’s EMS Stock Index Underperforms S&P
04/17/2018 | Lincoln InternationalThe overall EMS Index by Lincoln International posted a 5.1% decrease from last quarter—with the large index falling by 5.8%; the mid index, down 2%; and the small index shedding the most, at 8%.
Positive Outlook for European EMS Industry
12/22/2017 | Reed Electronics ResearchAfter a few years of very slow growth, the mood in the European EMS industry is more buoyant in 2017 and the prospects for further growth are good.
Evaluation of Stencil Technology for Miniaturization
12/22/2017 | Neeta Agarwal, et al.*SMT stencil printing technology continually evolves to keep pace with device miniaturization technologies. Printed circuit board assemblers have numerous new technology options to choose from, and need to determine the most effective ones to produce the highest quality and most reliable solder interconnections.
December Issue of SMT Magazine Available Now
12/04/2017 | I-Connect007The solder paste printing process accounts for almost 70% of PCB assembly defects. The December 2017 issue of SMT Magazine, which is available now, looks into the critical factors causing these challenges, and features strategies, tips and tricks, to help assemblers improve the yield and quality in the solder paste printing operation.