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RTW IPC APEX EXPO: Rehm Discusses Advantages of Moving Heat Technology
April 20, 2016 | Real Time with...IPCEstimated reading time: Less than a minute
Paul Handler, general manager of Rehm Thermal Systems, speaks with I-Connect007 guest editor Steve Williams about the advantages of the moving heat chamber compared to traditional technology in the market today, and why their systems are all Industry 4.0-ready.
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Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
New Representatives for Rehm Thermal Systems
05/11/2021 | Rehm Thermal SystemsSince 1 April 2021, Rehm Thermal Systems has gained two new representatives for its sales and service activities in Europe: Accelonix Ltd is now the official distributor for United Kingdom and Ireland, while Ankatek will in future look after the product portfolio in Turkey for Rehm Thermal Systems.
RTW NEPCON South China: Rehm Sees Growing Demand for Vacuum Soldering
09/28/2018 | Real Time With... NEPCON South ChinaRalf Wagenfuehr, plant manager of Rehm Thermal Systems (Dongguan) Ltd, speaks with I-Connect007’s Edy Yu about the developments in the company’s convection reflow soldering system, which features a vacuum module, aimed at addressing the increasing demand for vacuum soldering. He also discusses their software developments, as well as how they are helping their customers toward their Industry 4.0 journey.
Altus Releases New Technology Brochure
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Reflow Perspectives to Flex Circuit Assemblies
07/13/2018 | Stephen Las Marias, I-Connect007At the recent NEPCON China 2018 event in Shanghai, I spoke with Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, to gain insight into flex circuit assembly, and the challenges of reflow soldering. He also speaks about the need for industry forums focused on soldering flex printed circuits.
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