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Rogers Power Electronics to Show Data Matrix Code Capabilities at PCIM Europe 2016
April 26, 2016 | Rogers CorporationEstimated reading time: 3 minutes
Rogers Corporation’s Power Electronics Solutions (PES) group will be explaining and offering examples of its extended capabilities in applying data matrix codes for its various material-based product solutions at the upcoming PCIM Europe 2016 conference and exhibition (http://www.pcim-europe.com). PCIM Europe 2016, one of the top global technical conferences and exhibitions for power electronics technology, is scheduled for May 10-12, 2016 at the Nuremberg Exhibition Centre (Nuremberg, Germany).
Representatives from Rogers PES group will be in Hall 9 at Booth 406 to help visitors learn more about its many product solutions for power transfer and thermal management and to explore the benefits of using data matrix codes with many PES metalized substrate materials, including curamik® ceramic substrates, along with power modules, housings, and baseplates. Data matrix codes are essentially two-dimensional matrix codes consisting of black and white square cells arranged in square or rectangular patterns as a unique form of identification.
Identifying Substrates
Rogers can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. Codes, which can be text or numeric in form and encoded by code-reading camera systems, are written on metalized surfaces by means of a thin oxide layer formed by an optical laser system; no additional material is required on the substrate. In addition to bare copper surfaces, data matrix codes can be written on nickel (Ni), nickel/gold (Ni/Au), and silver (Ag) plated surfaces.
Standard data matrix code sizes are 2.3 × 2.3 mm and 3.0 × 3.0 mm, with other sizes available upon request. The single dot resolution is 0.164 × 0.164 mm. Positioning tolerance on a copper pad is ±0.3 mm. Using a data matrix code with 14 × 14 dots, for example, provides as many as 16 digits in a numeric code and 10 digits in an alphanumeric code.
Visitors to Rogers PES at PCIM Europe 2016 can learn more about these data matrix code capabilities, including how they can be put to practical use for managing material lots. Data matrix codes can add tracking and security numbers to a master card or every single piece on a master card and can be used to register such details as the lot number or the date of production.
PES Design Support Hub Resource for Engineers
Rogers PES brings its 40+ years of experience together in a handy online resource that is available 24/7. The PES Design Support Hub features complete technical information on
ROLINX busbars and curamik ceramic substrates, a library of technical papers on product design and problem solving, helpful videos on products and power distribution topics, and PES University training programs. Registration for access is quick and free. The Design Support Hub helps design engineers increase power, manage heat, and ensure the quality and reliability of their devices for optimal new product design (www.rogerscorp.com/designhub).
About Rogers PES
Rogers Corporation’s Power Electronics Solutions (PES) group, based in Eschenbach, Germany, specializes in power electronics solutions, including its ROLINX® and curamik® product lines. Rogers PES (www.rogerscorp.com/pes/index.aspx) applies advanced materials technologies to the transfer of energy and the management of heat resulting from high-power energy for a diverse range of applications, including in aerospace & defense, automotive, computing, industrial, medical and telecommunications markets.
About Rogers Corporation
Rogers Corporation (NYSE:ROG) is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, advanced transportation and other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification and alternative energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Connecticut (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide.
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Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.
Volatile Metals Market Creates PCB Pricing Headache
04/20/2026 | Nolan Johnson, I-Connect007Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.