New Glue Instantly Hardens with Electric Current
May 27, 2016 | Nanyang Technological UniversityEstimated reading time: 1 minute
Researchers at Nanyang Technological University in Singapore believe the adhesive may be a game-changer in manufacturing fields as diverse as biological implants and automobiles.
The new adhesive is a liquid gel that “cures” to form a polymer bond when a voltage of less than two volts is passed through it. Curing is the amount of time it takes for a glue to reach full strength after it dries. The glue stops curing as soon as the current is turned off. Users can fine-tune the bond’s strength and flexibility by varying the current’s voltage and duration.
The bonding agent is a light, low-viscosity flowing liquid that allows users to coat and exactly position the materials to be joined. Applying voltage to the gel then rapidly cures it to a strong bond with high elasticity and high shear strength.
Currently available quick-curing adhesives used in industry are activated by light, heat or chemical catalysts, each of which limits uses to particular materials and appropriate environments. Light-activated adhesives, for example, are only suited to materials that are somewhat transparent, while thermosetting can only be used with components that can tolerate heat.
Such quick-curing adhesives are used widely in the manufacture of medical devices, automobiles and other consumer goods, where they are favoured over more labour-intensive, heavier mechanical fasteners such as rivets, screws or bolts, which weaken the materials to be fixed. However, there has been little innovation in the field for decades.
Potential uses for electro-cured adhesives include biological devices for which photo- or thermo-setting glues are problematic, such as bioelectronics or polymer electronics designed for attachment to living tissue. The adhesive can be tuned to handle certain vibration frequencies or to match the firmness and flexibility of the soft tissue to which it will be attached.
In addition to biomedical uses, the new adhesive could make automotive assembly lines more efficient, since photo- and thermo-setting glues require costly, high-maintenance hardware.
Suggested Items
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Real Time with... IPC APEX EXPO 2024: Adhesive Materials and Equipment Update with Dymax
05/01/2024 | Real Time with...IPC APEX EXPOVirginia Hogan, global business development manager at Dymax, discusses adhesive materials, dispensing and curing equipment, a new, high-reliability conformal coating, and various materials and dispensing methods.
Real Time with... IPC APEX EXPO 2024: Sustainability in the Industry
04/26/2024 | Real Time with...IPC APEX EXPOGuest Editor Henry Crandall and Chris Nash of Indium Corporation discuss the company's 90th anniversary and its focus on sustainability. They focus on the benefits of sustainable materials, their compatibility, and value propositions. The conversation also highlights how Durafuse LT technology's role in reducing reflow temperatures is leading to significant cost and energy savings. Nash also touches on downstream sustainability efforts such as using recycled materials for packaging.
SMC Korea 2024 to Highlight Semiconductor Materials Trends and Innovations on Industry’s Path to $1 Trillion
04/24/2024 | SEMIWith Korea a major consumer of semiconductor materials and advanced materials a key driver of innovation on the industry’s path to $1 trillion, industry leaders and experts will gather at SMC (Strategic Materials Conference) Korea 2024 on May 29 at the Suwon Convention Center in Gyeonggi-do, South Korea to provide insights into the latest materials developments and trends. Registration is open.
Groundbreaking Ceremony Marks the Beginning of a New Era for Newccess Industrial; The Construction of the MINGXIN Building
04/12/2024 | Newccess IndustrialOn a clear and sunny day in March, the groundbreaking ceremony for the MINGXIN Building took place in Shenzhen, China. This moment marked the official commencement of construction for a project that will reshape the semiconductor materials industry.