-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current Issue
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Rogers’ John Coonrod on Insertion Loss
June 20, 2016 | Barry Matties, I-Connect007Estimated reading time: 7 minutes
John Coonrod of Rogers Corporation gave a keynote presentation at the recent Geek-A-Palooza trade show, concentrating on printed circuit board fabrication’s influences on insertion loss. I sat down with John to learn more about his presentation and what OEMs and designers need to be aware of to avoid insertion loss.
Barry Matties: John, why don't we start with a little background about what you do and where you’re from?
John Coonrod: I'm part of Advanced Connectivity Solutions at Rogers Corporation. We generally make high-frequency materials normally used in PCBs—specialty boards for the high-frequency microwave and millimeter wave range of frequencies. I do electrical characterization on our materials or competitor materials, if I can get my hands on them (laughs), and I also do evaluations on any kind of new materials that we are developing for electrical performance.
Matties: Nice, and you've been at Rogers for many years?
Coonrod: A long time, since 1987.
Matties: We are here at Geek-A-Palooza and you're doing a keynote. What is the topic of your presentation today?
Coonrod: The topic is insertion loss, and more specifically printed circuit board fabrication’s influences on insertion loss. Whenever you build a printed circuit board, just due to the nature of building the board, you will have some insertion loss variables. Really, what I'm going to be showing today are some of the studies I've done looking at that, and the effects of different PCB fabrication processes on insertion loss.
Matties: And in this presentation, what's going to be the takeaway for your audience?
Coonrod: More than anything else, I'm hoping this is going to be educational, because I start off with some really basic ideas about insertion loss and why it is important, and then I get into how these different PCB fabrication influences can have an effect. One of the reasons I'm doing this is for people who may not know much about insertion loss, and that way they get a good introduction and overview of it. Then the other idea, I'm hoping, is that people who do know something about insertion loss and do circuit designs will now know more about some of these variables that they may not have known about before.
Because I've run into that from time to time, where an OEM or someone will come to us and say, "Hey, your material is not working right," and then we find out it's not really the material, it's something special or something funny that happened between the design and the fabrication. The more the designers know about these things the better, I think.
Matties: Communication is key. Could you give a quick overview of insertion loss for those of our readers that may not know anything about it?
Coonrod: Insertion loss, in an RF sense and in a frequency sense, is really the total loss of the circuit. The way to think about it is when you apply RF power on one end of the circuit, and you try to take power off the other end, you don't get the same amount of power you put into it because there's some loss there, and that's really what the circuit is doing. It's kind of a complicated issue where there are several other things that come into play, but it's really just how much loss the circuit really causes to an applied RF signal.
Matties: Is the variable the design, primarily?
Coonrod: That's definitely part of it. There's really a big interaction between three important things: the materials, the design and the PCB fabrication. And that’s because, for one particular design, the PCB fabricator can build it multiple different ways and one way may impact the insertion loss differently than another way. So that is kind of my thought process here, and what I’ll be trying to show are some of these variables.
Page 1 of 2
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.