A New Generation of Electron Devices Makes Waves
July 18, 2016 | DARPAEstimated reading time: 1 minute
Normal radios operate in kilohertz (kHz) and megahertz (MHz) frequencies, bandwidths corresponding to electromagnetic oscillations in the thousands and millions of cycles per second ranges, respectively. Upping the ante, cell phones and radar systems operate in the billions of cycles per second range—that is, gigahertz (GHz) frequencies. But no one has managed to push radiofrequency technology into the trillions of cycles per second, or Terahertz (THz), range. With the Terahertz (THz) Electronics Program, however, DARPA has begun to make it possible. And as graphically depicted in the attached DARPA “fight” poster—fashioned after a promotion for the legendary bout in 1975 between Muhammed Ali and Joe Frazier in Manila, the Philippines—two promising and powerful approaches are dueling it out for possible dominance in this high-frequency electromagnetic frontier.
In one corner is the Solid State Power Amplifier (SSPA), which in 2014 was certified by Guinness World Records as the world’s fastest solid state chip, able to operate at THz speeds. This device, made of the semiconductor indium phosphide (InP), also can boost the power of a wide swath of incoming signals some thirtyfold (that’s what the “15 dB GAIN” spec in the poster indicates). In the other corner is a micromachined Traveling Wave Tube Amplifier (TWTA), a miniaturized device that relies on a tiny vacuum chamber in which electrons and radio signals interact. This wee bruiser can boost the power of a narrower range of THz frequencies by a factor of about 200 and was a celebrated darling of the 2016 IEEE International Vacuum Electronics Conference.
Of course, in reality this need not be a fight. “Really, the two contenders, both of them made by Northrop Grumman, are working as a tag team to collectively smack down the technical barriers that until now have made many THz applications impossible to realize,” said Dev Palmer, the DARPA program manager who has overseen the two-pronged research effort. “Together, the world-record SSPA and highly-acclaimed TWTA open the way to a THz future featuring devices that can generate, detect, process, and radiate extremely high-frequency signals, and push what is possible in areas ranging from high-resolution security imaging, collision-avoidance radar, high data rate communications, and remote detection systems for dangerous chemicals and explosives.”
Suggested Items
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Indium Elevates Two Leaders Advancing PCB Assembly Innovation
06/10/2025 | Indium CorporationWith its commitment to innovation and growth through employee development, Indium Corporation is pleased to announce the promotions of Wisdom Qu to Senior Product Manager for PCB Assembly Products and Kevin Brennan to Senior Product Development Specialist.
Indium Joins Virginia Tech Center for Power Electronics Systems Industry Consortium
06/03/2025 | Indium CorporationIndium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, has joined Virginia Tech’s Center for Power Electronics Systems (CPES), an industry consortium that supports power electronics initiatives to reduce energy use while growing capability.
Indium Promotes O’Leary to Director of Global Accounts
05/27/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to electronics, semiconductor, thin-film, and thermal management industries, announces the promotion of Brian O’Leary to Director of Global Accounts.
Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC
05/22/2025 | Indium CorporationIndium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.