Integration of Novel Materials with Silicon Chips Makes New 'Smart' Devices Possible
July 22, 2016 | North Carolina State UniversityEstimated reading time: 2 minutes
Researchers from North Carolina State University and the U.S. Army Research Office have developed a way to integrate novel functional materials onto a computer chip, allowing the creation of new smart devices and systems.
The novel functional materials are oxides, including several types of materials that, until now, could not be integrated onto silicon chips: multiferroic materials, which have both ferroelectric and ferromagnetic properties; topological insulators, which act as insulators in bulk but have conductive properties on their surface; and novel ferroelectric materials. These materials are thought to hold promise for applications including sensors, non-volatile computer memory and microelectromechanical systems, which are better known as MEMS.
“These novel oxides are normally grown on materials that are not compatible with computing devices,” says Jay Narayan, the John C. Fan Distinguished Chair Professor of Materials Science and Engineering at NC State and co-author of a paper describing the work. “We are now able to integrate these materials onto a silicon chip, allowing us to incorporate their functions into electronic devices.”
The approach developed by the researchers allows them to integrate the materials onto two platforms, both of which are compatible with silicon: a titanium nitride platform, for use with nitride-based electronics; and yttria-stabilized zirconia, for use with oxide-based electronics.
Specifically, the researchers developed a suite of thin films that serve as a buffer, connecting the silicon chip to the relevant novel materials. The exact combination of thin films varies, depending on which novel materials are being used.
For example, if using multiferroic materials, researchers use a combination of four different thin films: titanium nitride, magnesium oxide, strontium oxide and lanthanum strontium manganese oxide. But for topological insulators, they would use a combination of only two thin films: magnesium oxide and titanium nitride.
These thin film buffers align with the planes of the crystalline structure in the novel oxide materials, as well as with the planes of the underlying substrate – effectively serving as a communicating layer between the materials.
This approach, called thin film epitaxy, is based on the concept of domain-matching epitaxy, and was first proposed by Narayan in a 2003 paper.
“Integrating these novel materials onto silicon chips makes many things possible,” Narayan says. “For example, this allows us to sense or collect data; to manipulate that data; and to calculate a response – all on one compact chip. This makes for faster, more efficient, lighter devices.”
Another possible application, Narayan says, is the creation of LEDs on silicon chips, to make “smart lights.” Currently, LEDs are made using sapphire substrates, which aren’t directly compatible with computing devices.
“We’ve already patented this integration technology, and are currently looking for industry partners to license it,” Narayan says.
Suggested Items
Material Insight: The Dielectric Constant of PCB Materials
05/17/2024 | Dr. Preeya Kuray -- Column: Material InsightIn the world of PCB design, miniaturization can be achieved by using low dielectric constant (Dk) materials. Low Dk materials can allow for a reduction in thickness while maintaining a given trace width, leading to lower transmission loss and higher density circuitry.
IPC APEX EXPO: Some Thoughts About Growth
05/16/2024 | Dan Feinberg, I-Connect007After two and a half days of wandering the aisles at IPC APEX EXPO 2024, for the first time, I almost felt like I was exploring CES. There were so many booths and exhibits that I could describe, but I’d like to focus on the growth and huge value of this event, which has expanded well beyond just the growing and impressive exhibit show floor.
The Shaughnessy Report: Unlock Your High-speed Material Constraints
05/15/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportThe world of PCB materials used to be a fairly simple one. It was divided into two groups: the “traditional” laminates, often called FR-4, and the high-speed laminates developed especially for high-speed PCBs. These were two worlds that usually didn’t collide. But then traditional laminates started getting better, and high-speed designers and design engineers took notice and started to reconsider what FR-4 could be used for.
Breaking High-speed Material Constraints: Design007 Magazine — May 2024
05/14/2024 | I-Connect007 Editorial TeamDo you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems instead of high-speed materials, saving time and money while streamlining the fab process. In the May 2024 issue of Design007 Magazine, our contributors explain how to avoid overconstraining your materials when working with high-speed boards.
Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
05/13/2024 | Indium Corporationndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.