Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Inmarsat Launches NexusWave: A Game-Changing ‘Bonded’ Network Service For Maritime Communications

05/20/2024 | Inmarsat
Inmarsat Maritime, a Viasat company, has launched NexusWave, a fully managed connectivity service underpinned by a ‘bonded’ multi-dimensional network, offering high-speed connectivity, unlimited data, global coverage, and ‘secure by design’ infrastructure.

The Shaughnessy Report: Unlock Your High-speed Material Constraints

05/15/2024 | Andy Shaughnessy -- Column: The Shaughnessy Report
The world of PCB materials used to be a fairly simple one. It was divided into two groups: the “traditional” laminates, often called FR-4, and the high-speed laminates developed especially for high-speed PCBs. These were two worlds that usually didn’t collide. But then traditional laminates started getting better, and high-speed designers and design engineers took notice and started to reconsider what FR-4 could be used for.

Breaking High-speed Material Constraints: Design007 Magazine — May 2024

05/14/2024 | I-Connect007 Editorial Team
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems instead of high-speed materials, saving time and money while streamlining the fab process. In the May 2024 issue of Design007 Magazine, our contributors explain how to avoid overconstraining your materials when working with high-speed boards.

Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products

05/01/2024 | Real Time with...IPC APEX EXPO
Chris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.

Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products

04/24/2024 | Siemens Digital Industries Software
Siemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in