-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Heraeus and Intego Show a New Optical Inspection Method for Patterned Touch Sensors
August 4, 2016 | HeraeusEstimated reading time: 2 minutes
At this year Touch Taiwan from August 24-26, Heraeus launches a new touch panel process to pattern Clevios conductive polymer films by DFR (dry-film resist) photolithography. It enables high resolution patterns required for advanced touch sensor designs of flexible smartphones and tablets. Heraeus worked together with Intego on a new inspection method to visualize the invisible patterns of the Clevios sensor films. “With Intego, we found an excellent partner to offer a solution that enables our customers to accelerate the adoption of Clevios touch technology in mass production for flexible touch displays”, says Dr. Armin Sautter, Head of Technical Service Display at Heraeus. High resolution patterning of touch sensors is a prerequisite for advanced touch panels, especially for flexible and foldable touch displays. Dr. Thomas Wagner, CEO at Intego GmbH, emphazises “This is an important milestone, we are now able to offer a customized tool and a process for the inspection and quality control of the sensor patterning process for production environment.” A small scale demo tool will be shown at the Heraeus booth Taipei World Trade Center / Nangang Exhibition Hall 4F / N1029.
Patterned ITO films require additional optical compensation layers to hide the visible patterns in the touch panel. In contrast, both fine and wide Clevios patterns are already completely invisible after touch sensor production. No additional optical compensation layers are required in the touch panel process, offering customers cost benefits as well as process simplifications. Clevios conductive polymers are key materials for foldable touch sensors that will be used in the coming generations of flexible smartphones and tablets. Clevios coated films can be folded more than 300.000 times at a radius as low as 1 mm without degradation of the electro-optical properties.
About Intego GmbH
Intego GmbH, located in Erlangen, Germany, develops inspection systems for automated production lines used in a number of industries including glass/sapphire, solar, LED/OLED, electronics, automotive, plastics and medical technologies. (www.intego.de/en)
About Heraeus
Heraeus, the technology group headquartered in Hanau, Germany, is a leading international family-owned company formed in 1851. With expertise, a focus on innovations, operational excellence and an entrepreneurial leadership, we strive to continuously improve our business performance. We create high-quality solutions for our clients and strengthen their competitiveness in the long term by combining material expertise with technological know-how. Our ideas are focused on themes such as the environment, energy, health, mobility and industrial applications. Our portfolio ranges from components to coordinated material systems which are used in a wide variety of industries, including the steel, electronics, chemical, automotive and telecommunications industries. In the 2015 financial year, Heraeus generated revenues without precious metals of €1.9 bn and a total revenue of €12.9 bn. With approximately 12,500 employees worldwide in more than 100 subsidiaries in 38 countries, Heraeus holds a leading position in its global markets.
Suggested Items
Argonne, Toyota Collaborate on Cutting-Edge Battery Recycling Process
05/01/2024 | BUSINESS WIREThe U.S. Department of Energy’s (DOE) Argonne National Laboratory has recently launched a collaboration with Toyota Motor North America that could reduce the nation’s reliance on foreign sources of battery materials.
Real Time with… IPC APEX EXPO 2024: Outlining Rehm's Innovations and Global Presence
05/01/2024 | Real Time with...IPC APEX EXPOMichael Hanke, the chief sales officer for Rehm Thermal Systems, shares insights on the North American market, new machinery, and software development. He also discusses Rehm's turnkey solutions, process flexibility, global presence, and the dedicated team of 700 employees working on global solutions.
The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow: