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IPC Technical Education — PCB Troubleshooting
September 8, 2016 | IPCEstimated reading time: Less than a minute
Join IPC on November 2, 2016 for PCB Troubleshooting: Advanced Problem-Solving. The course will address many costly defects you may encounter, including: interconnect separation, delamination, wedge voids, plating folds, micro-voids, and hole-wall pull-away. Root cause is not always readily apparent, and participants will learn to trace problems through the manufacturing process — and prevent them.
- Explore a range of electrodeposition defects, such as mouse bites, pitting, and domed or crown plating.
- Learn about solderability and other assembly-related issues, such as outgassing, black pad, creep corrosion and blow holes
- Gain strategies to address solder mask peeling, poor circuit trace coverage, skips, bubbles, and poor adhesion in nickel gold plating
This full-day course will benefit team members involved in PCB fabrication and assembly.
Registration includes a copy of the instructor’s PowerPoint presentation and access to all activities at PCB Carolina. Class will be held in conjunction with this exhibition, which is presented by the local chapter of the IPC Designers Council. Students are encouraged to take advantage of the additional technical education offered by exhibits. For more information about the event, click here.
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Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.