The Knowledge Base: Unlocking the Invisible—The Critical Role of X-ray Technology
Standard of Excellence: Turning Negative Customer Feedback Into Positive Outcomes
Smart Automation: The Growing Role of Additive Manufacturing
Zentech Subsidiary Colonial Assembly and Design Receives $37.1M Navy Contract
September 14, 2016 | Zentech Manufacturing, Inc.Estimated reading time: Less than a minute
Colonial Assembly and Design, LLC., a wholly-owned subsidiary of Zentech Manufacturing, Inc. has received a United States Navy contract award in the amount of $37,191,138.00.
The contract is a firm-fixed-price, cost-plus-fixed-fee, indefinite-delivery/indefinite-quantity contract for providing design and fabrication, rapid prototyping, and technology integration related to circuit board design and radio frequency (RF) distribution assemblies, synthetic rope assemblies, mechanical fabrication, and fabric assemblies.
The Naval Surface Warfare Center Dahlgren Division, Dahlgren, Virginia, is the contracting activity (N00178-16-D-2025). This effort will support the Weapons Control and Integration Department.
Cynthia Snellings, VP Finance and Contracts at Colonial Assembly and Design comments, “we are extremely pleased to receive this five-year contract award and for the opportunity to continue our legacy of high-performance at Naval Surface Warfare Center - Dahlgren Division in support of our nation’s warfighters.”
About Colonial Assembly and Design:
Colonial Assembly and Design, LLC., a wholly-owned subsidiary of Zentech Manufacturing, Inc., is a privately held, engineering-driven contract manufacturer specializing in the design and manufacture of highly-complex electronic and RF circuit cards and assemblies. The company is headquartered in its purpose-built facility located in Fredericksburg, Va. and is ISO 9001:2008 certified and ITAR Registered.
Share on:
Suggested Items
Siemens Expands Global Electronics Intelligence Reach and Supplyframe Portfolio with Wevolver Acquisition
04/30/2025 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced its intention to acquire Wevolver, expanding its audience reach, enhancing the Supplyframe product portfolio, and combining digital marketing and integrated campaign programs that include go-to-market support and content creation.
Siemens, Intel Foundry Advance Collaboration
04/30/2025 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional technology enablement leveraging the foundry’s leading-edge technologies for next-generation integrated circuits (IC) and advanced packaging.
The EEcosystem and Dr. Eric Bogatin Launch Free Masterclass for Electronics Engineers
05/01/2025 | The EEcosystemThe EEcosystem, a podcast media and education brand serving professional electronics engineers, is proud to announce the launch of a new online learning platform: The EEcosystem Electronics Masterclass. The platform debuts with Transmission Lines 101, a free course created in partnership with world-renowned signal integrity expert Dr. Eric Bogatin. The course will be available starting May 1, 2025.
Keysight EDA, Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions
04/30/2025 | BUSINESS WIREKeysight Technologies, Inc. announced a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology, a cutting-edge innovation aimed at improving high-performance packaging solutions for artificial intelligence (AI) and data center markets in addition to the support of Intel 18A process node.
Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
04/29/2025 | Team NCAB -- Column: Fresh PCB ConceptsAs a field application engineer with many years of experience, I’ve conducted thousands of designs for manufacturing (DFM) analyses on printed circuit boards (PCBs). From basic one-layer boards to complex high density interconnect (HDI) designs, I’ve provided technical advice across a wide spectrum of technologies.