Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
ASC International to Demonstrate 100% High-Speed Offline SPI at SMTAI
September 20, 2016 | ASC InternationalEstimated reading time: 1 minute
ASC International has announced that its VisionPro HSi will be featured in Booth #140 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, Illinois.
VisionPro HSi is a high-speed, sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a few minutes training, an operator can perform accurate 100 percent - 3D measurements of solder paste pads, BGAs and many other PCB features. The VisionPro HSi automated solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.
“We have found great success with the VisionPro HSi due to its ability to fully characterize the overall print of a PCB,” stated Steve Arneson, National Business Manager. “This valuable feedback is then used to make the proper correction actions to the print parameters and board supports to allow for a solid print process to exist.”
In addition to the VisionPro HSi, ASC International will demonstrate its industry-leading VisionPro M500 bench top SPI system, its unique SPI/AOI combination system called the LineMaster DM, and the Unicomp X-ray machine.
About ASC International, Inc.
Since its foundation in 1992, ASC International has become a leading supplier of AOI and SPI systems and custom sensor technology integration. Headquartered in Minneapolis, Minnesota, ASC International provides customers with the service and support needed to realize the value of their investment in inspection and process control systems. ASC International’s customers include world-class organizations like Celestica, Creation Technologies, Flextronics, Honeywell, Jabil, Lockheed Martin, Plexus, Rockwell Automation and Sanmina-SCI to name just a few. For more information, click here.
Share on:
Suggested Items
Koh Young Installs 24,000th Inspection System at Fabrinet Chonburi
05/07/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at Fabrinet Chonburi in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.