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'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
May 2, 2025 | TopLineEstimated reading time: Less than a minute
Braided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly. On May 6, Martin Hart, President of TopLine Corporation and holder of multiple patents in the field of electronic components, will present “Braided Solder Columns for Cold Electronics - Moon, Mars and Beyond” at the SPACE PARTS WORKING GROUP (SPWG) 2025, an international forum in El Segundo, California, to disseminate information to the aerospace industry and to resolve problems with high-reliability electronic piece parts needed for space and missile applications. In-person attendance will be held at The Aerospace Corporation, 210 S. Douglas Street, El Segundo, CA 90245.
“Braided Solder Columns are non-collapsible, robust and compliant structures used for reducing stress caused by CTE mismatch,” Hart says. “Columns are more reliable than solder balls, especially when connecting large-size chip packages to PC Boards operating in cryogenic environments. Additionally, they are available with lead for Aerospace & Defense applications, but also available in lead-free designs for RoHS AI Datacenters, for example.”
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05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.