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Dymax Receives Another U.S. Patent
September 21, 2016 | Dymax CorporationEstimated reading time: 1 minute
Dymax Corporation has recently announced it has been awarded a new patent by the United States Patent and Trademark Office (USPTO). US Patent No. 9,394,436 entitled “Form-In-Place Gasket With Tack Free Surface” was received for a method for preparing a flexible, substantially tack free gasket by forming a liquid composition that would enclose displays, electronic circuits and similar components.
This composition is distributed onto a substrate and then exposed to actinic radiation to cure the liquid composition into a flexible, substantially tack free gasket having a Shore A hardness range of A20 to A80. Resins formulated with this patented formula, such as GA-201, can be dispensed into intricate and complex configurations with the added benefit of curing in-line which allows for increased production speed and reduced inventories.
About Dymax Corporation
Dymax Corporation develops innovative oligomer, adhesive, coating, dispensing, and light-curing systems for applications in a wide range of markets. The company’s products are perfectly matched to work seamlessly with each other, providing design engineers with tools to dramatically improve manufacturing efficiency and reduce costs. Major markets include aerospace, appliance, automotive, electronics, industrial, medical device, and metal finishing.
For additional information, visit www.dymax.com or contact Dymax Application Engineering at info@dymax.com or 860-482-1010.
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