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IPC Concerned about ECHA’s Draft Guidance on Substances in Articles
September 29, 2016 | IPCEstimated reading time: Less than a minute
On September 22, 2016, IPC submitted comments to the European Chemicals Agency (ECHA) highlighting our concerns with the draft guidance on requirements for substances in articles, version 4.0.
In the comments, IPC highlights concerns that guidance is confusing and lengthy and suggests specific changes.
On July 27, 2016 ECHA published draft guidance on the application of REACH (Registration, Evaluation and Authorization of Chemicals) to substances in articles.
The court ruling directly affects the disclosures required of articles manufacturers. The new guidance addresses the EU Court of Justice ruling on September 10, 2015 on the that levels of substances of very high concern (SVHCs) must be calculate at the level of the “simple” article, not over the weight of the entire article as imported or as provided to the customer as stated in ECHA’s 2011 guidance.
A final guide is expected by the end of 2016 or early 2017 and the EU member states are planning a six- month enforcement pilot in early 2017.
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.