-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Dr. Jennie Hwang to Address Solder Joint Reliability and Role of Intermetallic Compounds at IMAPS
October 6, 2016 | Dr. Jennie S. Hwang, H-Technologies GroupEstimated reading time: 1 minute
Solder joint reliability plays a critical role in the reliability of the entire spectrum of end-use electronic products from commercial to military from computing to smartphone from medical to avionic applications. In lead-free electronics, intermetallic compounds become increasingly important to the performance and reliability of solder interconnections in the chip level, package level and board level. Understanding the essential fundamentals and key factors behind intemetallics and solder joint reliability is a necessity to designing and manufacturing reliable products.
On October 10, Dr. Jennie S. Hwang leverages decades of extensive real-world experiences and deep knowledge of the industry by presenting on solder joint reliability and the role of intermetallic compounds at the upcoming IMAPS 2016 (49th International Symposium on Microelectronics) event, which will be held from October 10–13 in Pasadena, California. Dr. Hwang will discuss relevant aspects of solder joint reliability at Workshop B1 – "Reliability of Electronics – The Role of Intermetallic Compounds", and Workshop B2 – "Solder Joint Reliability - Principles and Applications". Attendees are encouraged to bring their own selected systems for deliberation.
Workshop B1 topics are as follows:
- Solder joint fundamentals – mechanical properties vs. microstructure evolution vs. services;
- Solder joint thermo-mechanical behavior and degradation – fatigue and creep interaction;
- Solder joint failures modes - interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced, surface-crack, and others;
- Solder joint failure mechanisms – ductile, brittle, ductile-brittle transition fracture;
- Solder joint strengthening metallurgy;
- Power of metallurgy for increased fatigue resistance and creep resistance;
- Distinctions and commonalties between Pb-free and SnPb solder joints;
- Thermal cycling conditions - effects on test results and test results interpretation;
- Testing solder joint reliability – discriminating tests and discerning parameters;
- Solder joint performance in harsh environments;
- What are on the horizon and what impact will be on reliability- present vs. future system;
- Best practices – competitive manufacturing (yield, cost, reliability);
- Ultimate reliability.
Workshop B1 topics are as follows:
- Intermetallic compounds – definition, fundamentals, and characteristics;
- Intermetallic compounds in the intrinsic material- Pb-free vs. SnPb;
- Formation and growth during production process and in product service life;
- Different types of intermetallic compounds – effects on solder joint reliability;
- Intermetallic compounds - at-interface vs. in-bulk;
- Effects from substrates (hybrid module thick film pads, PCB surface finish) + component coating;
- SAC alloys incorporated with various doping elements – characteristics, performance;
- Effects on failure mode;
- Effects on reliability.
For more information or to register, visit http://www.imaps.org/imaps2016/pdcs.htm#b1 and http://www.imaps.org/imaps2016/pdcs.htm#b2.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.