Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Dr. Jennie Hwang to Address Solder Joint Reliability and Role of Intermetallic Compounds at IMAPS
October 6, 2016 | Dr. Jennie S. Hwang, H-Technologies GroupEstimated reading time: 1 minute
Solder joint reliability plays a critical role in the reliability of the entire spectrum of end-use electronic products from commercial to military from computing to smartphone from medical to avionic applications. In lead-free electronics, intermetallic compounds become increasingly important to the performance and reliability of solder interconnections in the chip level, package level and board level. Understanding the essential fundamentals and key factors behind intemetallics and solder joint reliability is a necessity to designing and manufacturing reliable products.
On October 10, Dr. Jennie S. Hwang leverages decades of extensive real-world experiences and deep knowledge of the industry by presenting on solder joint reliability and the role of intermetallic compounds at the upcoming IMAPS 2016 (49th International Symposium on Microelectronics) event, which will be held from October 10–13 in Pasadena, California. Dr. Hwang will discuss relevant aspects of solder joint reliability at Workshop B1 – "Reliability of Electronics – The Role of Intermetallic Compounds", and Workshop B2 – "Solder Joint Reliability - Principles and Applications". Attendees are encouraged to bring their own selected systems for deliberation.
Workshop B1 topics are as follows:
- Solder joint fundamentals – mechanical properties vs. microstructure evolution vs. services;
- Solder joint thermo-mechanical behavior and degradation – fatigue and creep interaction;
- Solder joint failures modes - interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced, surface-crack, and others;
- Solder joint failure mechanisms – ductile, brittle, ductile-brittle transition fracture;
- Solder joint strengthening metallurgy;
- Power of metallurgy for increased fatigue resistance and creep resistance;
- Distinctions and commonalties between Pb-free and SnPb solder joints;
- Thermal cycling conditions - effects on test results and test results interpretation;
- Testing solder joint reliability – discriminating tests and discerning parameters;
- Solder joint performance in harsh environments;
- What are on the horizon and what impact will be on reliability- present vs. future system;
- Best practices – competitive manufacturing (yield, cost, reliability);
- Ultimate reliability.
Workshop B1 topics are as follows:
- Intermetallic compounds – definition, fundamentals, and characteristics;
- Intermetallic compounds in the intrinsic material- Pb-free vs. SnPb;
- Formation and growth during production process and in product service life;
- Different types of intermetallic compounds – effects on solder joint reliability;
- Intermetallic compounds - at-interface vs. in-bulk;
- Effects from substrates (hybrid module thick film pads, PCB surface finish) + component coating;
- SAC alloys incorporated with various doping elements – characteristics, performance;
- Effects on failure mode;
- Effects on reliability.
For more information or to register, visit http://www.imaps.org/imaps2016/pdcs.htm#b1 and http://www.imaps.org/imaps2016/pdcs.htm#b2.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.