-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Techcon Systems to Display New Positive Displacement PC Pump at The ASSEMBLY Show
October 25, 2016 | Techcon SystemsEstimated reading time: 1 minute
Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, will exhibit in Booth #345 at The ASSEMBLY Show, this week from Oct. 25-27, 2016 in Rosemont, Illinois. The team will demonstrate the new TS8100 Series Positive Displacement PC Pump, along with its dispensing robots. The continuously volumetric dispense pump is based on Progressive Cavity (PC) technology.
The turning rotor on the TS8100 moves the fluid in tightly sealed cavities through the stator’s fluid chambers to create a volumetric fluid flow that does not change the shape or size of the fluid. Due to the PC pump’s unique dispensing technology, accuracy and repeatability of ± 1 percent is achievable.
The TS8100 comes standard with a syringe bracket, mounting bracket kit, luer lock fitting, cleaning kit and dispensing tip selection pack. Typical applications include: under filling PCBA components, encapsulation and potting applications, applying lubrication on automotive parts, and dispensing pastes and flux.
Techcon also will showcase its new TSR2000 Bench Top Robot Series that has been designed for a wide range of fluid dispensing applications, from inline to batch. The versatile TSR2000 dispensing platforms deliver consistent, high-performance dispensing results at an affordable price. The TSR2000 Series is ideal for the following applications: dispense dots of solder paste, form-in-place gasket, filling, potting, encapsulation, bonding, coating and many more. Three models are available (TSR2201, TSR2301 and TSR2401) to accommodate a wide range of working envelopes.
Company representatives also will showcase consumable plastic containers, including cartridges, syringes, Techkits, squeeze bottles and clever barrier bags.
About Techcon Systems
Techcon Systems was established in 1961 to service industrial manufacturing markets and has continued to be a leader in fluid dispensing systems and products. In 1996, OK International acquired Techcon Systems, providing a strong global sales channel, with direct subsidiaries in the UK. Today, Techcon represents OK International’s Industrial Product Division. Currently focusing on fluid dispensing systems, Techcon’s components are used in medical, automotive, telecommunications, aerospace, and industrial applications worldwide, helping to improve manufacturing processes and increase the customers’ bottom lines. Techcon offers an array of fluid dispensing products and provides dispensing components ranging from disposable accessories to complete microprocessor-controlled dispensing systems, and precision valves. For more information, visit the company at www.techcon.com.
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.