-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
AIM Provides IPC-A-610 Training in Rio Grande, Argentina
October 31, 2016 | AIM SolderEstimated reading time: 1 minute
AIM Solder is pleased to announce that it recently provided the first-ever IPC-A-610 training and certification program to engineers and industry professionals in Rio Grande, Argentina.
AIM’s Technical Marketing Engineer, Andres Rojas, provided the Certified IPC Specialist (CIS) training, which is designed to prepare line workers, operators, inspectors, managers and buyers to make informed decisions when assessing the quality and reliability of electronic assemblies according to the IPC quality standard.
The training was offered in collaboration with AIM’s local authorized distributor, High Tech Solutions. Of the more than thirty engineers and industry professionals, including several outstanding students from the National Technological University, that participated, eighteen were awarded the Application Specialist (CIS) certification, and the rest were recognized by AIM for having completed the IPC-A-610 training program.
“I am very happy and grateful for this opportunity and the incredible support we received from those who participated,”said Andres Rojas, AIM’s Technical Marketing Engineer. “This initiative speaks to the efforts of AIM and our business partner High Tech Solutions to strengthen AIM’s presence in the southern part of the continent.”
“As a leading provider in the electronics industry, we are thrilled to have collaborated in training technicians and engineers on international standards to aid in the ongoing process of sustainable industrial development,” said Gaston Hervidas, High Tech Solutions’s Operations Director. “We would like to thank AIM Solder for their support and cooperation in bringing this valued training to Argentina,” said Diego Monzon, High Tech Solutions’s Commercial Director.
“This type of training program is ideal for promoting professional growth in the electronics industry,” said Martin Lozano, Process Engineer at Electrofueguina S.A. “It provides opportunity for all to understand industry requirements and ensure compliance with IPC standards.”
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.