-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Metcal to Exhibit at the SMTA New England Expo
November 1, 2016 | MetcalEstimated reading time: 1 minute
Metcal will exhibit at the SMTA New England Expo, scheduled to take place Thursday, November 3, 2016 at the DCU Center in Worcester, Massachusetts. Company representatives will showcase the Metcal USF-1000 Solder Wire Feeder, along with Metcal's proven rework and repair equipment, including the Scorpion Rework System and MX-5200 Soldering System.
The new Metcal USF-1000 Solder Wire Feeder adds a new level of control and convenience to the soldering process. Designed to integrate easily with Metcal’s MX-5200 or MX-500 series solder systems, the Solder Wire Feeder increases soldering speed while it eliminates wasteful tangles and unspooling.
The Scorpion redefines precision and addresses the technical demands presented by component manufacturers today. Metcal's Automatic Placement Package is capable of 50mm of motorized travel in the Z-axis and a full 360° in ϴ (Theta). The Automatic Placement Package offers fine motor control in the Z-axis and ϴ during alignment of the component to the pad. The new force feedback control during the placement process enables the unit to accurately pick and place components without disturbing the component or solder.
The MX-5200 series features a dual-simultaneous use option, meaning that two hand-pieces can work from one power supply at the same time. The dynamic option enables the two hand-pieces to share 80 watts output power based on demand, adding even more application flexibility and speed. Four different hand-pieces and a comprehensive range of soldering and rework cartridges support the MX-5200 Series simultaneous dual operation. These include the Metcal Advanced Hand-Piece for SMD rework, a Metcal Ultra-Fine Hand-Piece for fine access, a Precision Tweezer capable of removing a range of components from 0201 chips to 28mm SOICs, and a Desoldering Gun for safely removing through-hole components.
About Metcal
Since 1982, Metcal has been a recognized worldwide leader in the electronics assembly marketplace. As part of OK International, Metcal's industry-leading position addressing advanced technology in conduction soldering and rework/repair, has and will continue to broaden to a full electronics bench tool single-source solution. Metcal product lines currently include: hand soldering and desoldering, convection rework products, fume extraction and fluid dispensing tools. For more information, click here.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.